ECCA News
EECS Project Update
2009-12-01
Work is now well underway for Work Package 3 - Technical Requirements Analysis and Scientific Solutions. A requirement of this work package is to develop the EECS Technical Specifications. Currently a draft EECS four core technical specification is being developed among the three RTDs of the Project.
A meeting will take place in Dublin on December 7th 2009 to allow each RTD to present the Card Application Management System (CAMS), the Card Application Interface (CAI) and the Student Connectivity System (SCS). Following this presentation a discussion/workshop will take place regarding their integration. At this meeting the consortium will also review and plan the next stage of Work Package three and the technical specification process.
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